A, SMT SMT processing required:
1, the real documents: the quantity of processing, processing technology, materials list, BOM single, silk screen drawing, parametric graph, steel net (by the Division I buy on sb's behalf);
2, electronic data: to ensure your products under the principle of confidentiality, processing only accept our coordinate file (file formats: TXT or EXECL), screen printing maps and electronic file BOM single, I Division provides a coordinate file generation method of reference (video), the PCB coordinate origin please placed in the plate edge angle;
3, technology standards: all our production files to B0M standards for production, processing, customer shall provide the model accurately check the BOM; only do confirm the direction and height of parts, not as BOM and material check;
3.1 if the data is not available, the additional costs of market department cost accounting, back again. According to the actual loss of data on the concrete calculation time cost.
3.2 if your company to provide information or sample direction and height error, cause the bulk of bad, do not repair treatment free. If you need our cooperate to handle, transfer market department cost accounting.
4, the real documents, electronic materials, electronic materials, steel mesh and PCB are available, can arrange production, unless the customer notice in writing empty post shipment.
Two, the processing of proposals and processing of the request:
2.1 PCB shape appearance dimension
2.1.1 PCB cannot be less than the number of dimensions or components of 50*50mm less than 50, must do PCB jigsaw process, the reasonable size of not more than 300*250mm;
The solution: additional fixture fee and artificial upper and lower tool costs;
2.1.2 PCB for the orthotropic plate refers to both sides can not be of equal length parallel side of the PCB board, such as:
Approach: the additional fixture fixture fee and artificial cost.
2.2 PCB design issues, customer special requirements of production, Division I don't do any free repair treatment:
The 2.2.1 pad had holes, lead tin into the through hole, resulting in fewer elements of tin and solder;
2.2.2 pad design is too large, less than "figure B" contact surface, element migration, weld caused;
2.2.3 pad design is too small, covering the pad can not be tested solder joints, elements, false welding caused by weld;
2.2.4 pad oxidation, element, false welding caused by weld;
2.2.5 PCB is not design process boundary or edge in 5mm devices, the need to use the mold, cause the error generated offset. The solution: add artificial recharge of tin charges.
Three, on the procurement of components and design issues, Division I don't do any free repair treatment:
3.1 the actual incoming and PCB pad size does not match, the customer special requirements of production, resulting in poor quality;
3.2 practical materials for renovation of old material or material, customer special requirements of production, resulting in poor quality;
3.3 the actual incoming oxidation, customer special requirements of production, resulting in poor quality;