1 packing density is high, chip components than the conventional perforated element area and quality greatly reduced. In general, using SMT 'can reduce the volume of electronic products to 60%, reduce the quality of' 75%. Through hole mounting technology of components, they press the 2.54mm grid installed components, while the SMT assembly of components from 1.27mm to the current grid 0.63mm grid, 0..5mm grid installation components in certain cases, higher density. For example, a 64 pin DIP integrated block assembly area, it is 25mm * 75mm, while the same wire using wire spacing is 0.63mm QFP, the assembly area it is 12mm * 12mm, area of the through hole technology 1 / 12.
2 high reliability, because the reliability of chip component is high, the device is small and light, anti-seismic capability is strong, the use of automated production, mount the reliability is high, the general bad solder joint rate of less than ten ppm, ratio through hole inserted element wave soldering technology is one order of magnitude lower, with the SMT assembly of electronic products MTBF for an average of 250000 hours at present, almost 90% of electronic products by SMT technology.
3 high frequency characteristics, the chip component mounting device is firm, no lead or short leads, reduces the influence of parasitic inductance and parasitic capacitance, improves the high frequency characteristics of the circuit of the circuit, the highest frequency of SMC and SMD design of up to 3GHz, and the use of through hole components is only 500MHz. Using SMT can shorten transmission delay time, can be used for the clock frequency of the circuit above 16MHz. If the use of MCM technology, computer workstation high-end clock frequency is 100MHz, the power loss caused by the parasitic reactance can be reduced by 2 ~ 3 times.
4 cost reduction, reduced use of printed circuit board area, area of 1 / 12 through hole technology, if use the CSP installation is the area also significantly decreased.